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Technical Support

Penn Emblem Technical Support

Contact Penn Emblem for support on all products and services.

For Products, please contact:

Aaron Singh 800-793-7366, Extension 198 aarsig@pennemblem.com
Eric Kramer 800-793-7366, Extension 319 ekramer@pennemblem.com

For Web Applications Training, please contact:

ssales@pennemblem.com

Click Here to Download the Technical Specifications for Custom Embroidered Emblems

Click Here to Download the Technical Specifications for ColorPrint™ Sublimated Emblems

Click Here to Download the Technical Specifications for Flame Resistant Emblems

Click Here to Download the Technical Specifications for Blank Emblems

Click Here to Download Technical Specifications for PennTrans™ Heat Transfers

Click here to download the Heat Seal Parameters for ExpressPrint T7 Label Tape

Technical Support Videos

Check out our Technical Support Videos for quick tutorials on emblem placement, heat sealing emblems and properly caring for your machines.

Heat Seal Application Parameters for All Products

Technical Settings for Heat Seal Application
All Penn emblems may be sewn or heat applied. If you heat apply these emblems, you must be aware of the performance characteristics of your heat seal machines. The proper bonding temperature is 405°F – platen surface. The bonding time will vary depending upon the power of your machines. A machine with a 3″ cylinder, 4 x 6 platen and supplied by 80 lbs per sq. in. of air for example, will bond Penn Bond 2000® emblems in 14 seconds. More powerful machines will bond in less time.

Click here to Download a PDF of the Specifications for the Heat Press

Please contact your Penn sales representative for specific information on your machines, and ask for your copy of “The ABC’s of Heat Sealing” – a complete guide to applying all Penn Emblem products.

SETTINGS FOR HEAT SEALING (AIR PRESSURE ON ALL = 80 PSI)

Penn Sublimated and ColorPrint® Emblems

Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 405°F 405°F 405°F
Dwell Time: (Seconds) 10 14 12 14

Embroidered Emblems

Bottom Heat Bonding (a) Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X (a) 405°F
Dwell Time: (Seconds) 10 14 12 14

PennText® Emblems

Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 375°F X (a) 405°F
Dwell Time: (Seconds) 10 14 12 14

PennText® With Merrow Border Emblems

Bottom Heat Bonding (a) Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X (a) 405°F
Dwell Time: (Seconds) 10 14 12 14

PennBroidery® For Woven Shirts

Bottom Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F X (a) 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X (a) 405°F
Dwell Time: (Seconds) 10 14 X (a) 14

PennBroidery® With Knit Shirts

Bottom Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F X (a) 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X (a) 405°F
Dwell Time: (Seconds) 10 14 X (a) 14

(a) HP Press is not recommended for bottom heat bonding. Bottom Platen for HP8 press does not have a heating element.
(b) For Polyurethane based backing only.
(c) Econo Wiz with 4 x 6 platen. Econo Wiz with 2 x 4 platen would have the same specs.

* Note for all knit shirts: We recommend using a small piece of sponge rubber (approximately 1/2″ large on all sides than the emblem) as the top platen. When using this method, reduce the air pressure from 80 to 60 psi. Then place the garment on the bottom platen, position the PennBroidery® and place the piece of rubber on top and cycle the machine. This reduces the platen mark on the knit shirt.

Dot Matrix Computer Labels

Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 375°F X (a) 405°F
Dwell Time: (Seconds) 8 12 10 12

Mending Materials

Top Heat Bonding (b) Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 375°F X (a) 405°F
Dwell Time: (Seconds) 8 12 10 12

The above information is a recommendation only. There are circumstances which may be different. Please check on information not listed above.

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