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Technical Support

Penn Emblem has an experienced technical support service team who can assist with any questions on heat seal applications, product knowledge or how to load a machine. Please refer to our technical support videos or tech sheets for more information.

borderContact Penn Emblem for support on all products and services.

For Products Please Contact
  • Aaron Singh
  • 800-793-7366, Extension 8720
  • aarsig@pennemblem.com
  • Eric Kramer
  • 800-793-7366, Extension 3998
  • ekramer@pennemblem.com
For Web Applications Training Please Contact
  • ssales@pennemblem.com

bordertechnical support videos

Check out our Technical Support Videos for quick tutorials on emblem placement, heat sealing emblems and properly caring for your machines.

Bottom Heat Sealing Tutorial from Penn Emblem Co

Tips for Heat Sealing Thicker Garments

Tips for Proper Emblem Placement

The Do’s and Don’ts of Heat Sealing Emblems

Top Heat Sealing Tutorial

borderHeat Seal Application Parameters for All Products

Heat Seal
Technical Settings for Heat Seal Application

All Penn emblems may be sewn or heat applied. If you heat apply these emblems, you must be aware of the performance characteristics of your heat seal machines. The proper bonding temperature is 405°F – platen surface. The bonding time will vary depending upon the power of your machines. A machine with a 3″ cylinder, 4 x 6 platen and supplied by 80 lbs per sq. in. of air for example, will bond Penn Bond 2000® emblems in 14 seconds. More powerful machines will bond in less time.

Download Specifications for the Heat Press

borderSETTINGS FOR HEAT SEALING (AIR PRESSURE ON ALL = 80 PSI)

Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 405°F 405°F 405°F
Dwell Time: (Seconds) 10 14 12 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X(a) 405°F
Dwell Time: (Seconds) 10 14 12 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X(a) 405°F
Dwell Time: (Seconds) 10 14 12 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber0 405°F 375°F 405°F 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X(a) 405°F
Dwell Time: (Seconds) 10 12 12 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F X(a) 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X(a) 405°F
Dwell Time: (Seconds) 10 14 X(a) 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Rubber) 405°F 375°F X(a) 405°F
Bottom Plate Temp: (Teflon) 405°F 405°F X(a) 405°F
Dwell Time: (Seconds) 10 14 X(a) 14
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 375°F X(a) 405°F
Dwell Time: (Seconds) 8 12 10 12
Top Heat Bonding Wizard HP4 HP8 Econ Wiz (c)
Top Plate Temp: (Teflon) 405°F 405°F 405°F 405°F
Bottom Plate Temp: (Rubber) 405°F 375°F X(a) 405°F
Dwell Time: (Seconds) 8 12 10 12

The above information is a recommendation only. There are circumstances which may be different. Please check on information not listed above.

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Technical Specifications for Custom Embroidered Emblems Download
Technical Specifications for ColorPrint™ Sublimated Emblems Download
Technical Specifications for Flame Resistant Emblems Download
Technical Specifications for Blank Emblems Download
Technical Specifications for PennTrans™ Heat Transfers Download
Heat Seal Parameters for ExpressPrint T7 Label Tape Download
Specifications for the Heat Press Download
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